Multi-chip module

A ceramic multi-chip module containing four POWER5 processor dies (center) and four 36 MB L3 cache dies (periphery).

A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it is treated as if it were a single component (as though a larger IC).[1] Other terms, such as "hybrid" or "hybrid integrated circuit", also refer to MCMs.

Overview

Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed circuit board (PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a high density interconnection (HDI) substrate.

Multi-Chip Module packaging is an important facet of modern electronic miniaturization and micro-electronic systems. MCMs are classified according to the technology used to create the HDI substrate.

Chip stack MCMs

A relatively new development in MCM technology is the so-called "chip-stack" package.[2] Certain ICs, memories in particular, have very similar or identical pinouts when used multiple times within systems. A carefully designed substrate can allow these dies to be stacked in a vertical configuration making the resultant MCM's footprint much smaller (albeit at the cost of a thicker or taller chip). Since area is more often at a premium in miniature electronics designs, the chip-stack is an attractive option in many applications such as cell phones and personal digital assistants (PDAs). After a thinning process, as many as ten dies can be stacked to create a high capacity SD memory card.[3]

Examples of MCM technologies

See also

References

  1. ↑ Rao Tummala, Solid State Technology. “SoC vs. MCM vs SiP vs. SoP.” Retrieved August 4, 2015.
  2. ↑ Jon Worrel (15 April 2012). "Intel migrates to desktop Multi-Chip Modules (MCMs) with 14nm Broadwell". Fudzilla.
  3. ↑ Richard Chirgwin, The Register. “Memory vendors pile on '3D' stacking standard.” April 2, 2013. February 5, 2016.
  4. ↑ Satoru Iwata, Iwata Asks. “Changes in Television.” Retrieved August 4, 2015.
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