HiSilicon
Native name | 海思半导体有限公司 |
---|---|
Subsidiary | |
Traded as | HiSilicon |
Industry | Fabless semiconductors, Semiconductors, Integrated circuit design |
Founded | 2004 |
Headquarters | Shenzhen, Guangdong, China |
Products | SoCs |
Parent | Huawei |
Website |
www |
HiSilicon | |||||||
Simplified Chinese | 海思半导体有限公司 | ||||||
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Traditional Chinese | 海思半導體有限公司 | ||||||
Literal meaning | Haisi Semiconductor Limited Company | ||||||
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HiSilicon (Chinese: 海思; pinyin: Hǎisī) is a Chinese fabless semiconductor company based in Shenzhen, Guangdong and fully owned by Huawei.
HiSilicon purchased licenses from ARM Holdings for at least ARM Cortex-A9 MPCore, ARM Cortex-M3, ARM Cortex-A7 MPCore, ARM Cortex-A15 MPCore,[1][2] ARM Cortex-A53, ARM Cortex-A57 and also for their Mali graphics cores.[3][4]
HiSilicon also purchased licenses from Vivante Corporation for their GC4000 graphics core.
HiSilicon is reputed to be the largest domestic designer of integrated circuits in China.[5]
Products
K3V1
Model Number | Fab | CPU | GPU | Memory Technology | Nav | Wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISA | Microarchitecture | Cores | Frq (MHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
K3V1 (Hi3611) | 130 nm | ARMv5 | ARM9E | 1 | 800 | 2009 | List
|
K3V2
The first well known product of HiSilicon is the K3V2 used in Huawei Ascend D Quad XL (U9510) smartphones[6] and Huawei MediaPad 10 FHD7 tablets.[7] This chipset is based on the ARM Cortex-A9 MPCore fabbed at 40 nm and uses a 16 core Vivante GC4000 GPU.[8] The SoC support LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.
Model Number | Fab | CPU | GPU | Memory Technology | Nav | Wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
K3V2 (Hi3620) | 40 nm | ARMv7 | Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB | 4 | 1.4 | Vivante GC4000 | 240 MHz
(15.3GFlops) |
LPDDR2 | 64-bit dual-channel | 7.2 (up to 8.5) | N/A | N/A | N/A | N/A | 2012 | List
|
K3V2E
This is a revised version of K3V2 SoC with improved support of Intel baseband. The SoC support LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.
Model Number | Fab | CPU | GPU | Memory Technology | Nav | Wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
K3V2E | 40 nm | ARMv7 | Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB | 4 | 1.5 | Vivante GC4000 | 240 MHz
(15.3GFlops) |
LPDDR2 | 64-bit dual-channel | 7.2 (up to 8.5) | N/A | N/A | N/A | N/A | 2013 | List
|
Kirin 620
• supports - USB 2.0 / 13 MP / 1080p video encode
Model Number | Fab | CPU | GPU | Memory Technology | Nav | Wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
Kirin 620 | 28 nm | ARMv8-A | Cortex-A53 | 8 | 1.2 | Mali-450 MP4 | 533 MHz | LPDDR3 ( MHz) | 32-bit single-channel | 6.4 | N/A | Dual SIM LTE Cat.4 (150Mbit/s) | 802.11 b/g/n (Wifi Direct & Hotspot) Not Supporting DLNA / Miracast | Bluetooth v4.0, A2DP, EDR, LE | Q1 2015 | List
|
Kirin 650, 655, 658
Model Number | Fab | CPU | GPU | Memory Technology | Nav | Wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
Kirin 650 | 16 nm FinFET+ | ARMv8-A | Cortex-A53 Cortex-A53 |
4+4 | 2.0 (4xA53) 1.7 (4xA53) | Mali-T830 MP2 | 900 MHz
(40.8GFlops) |
LPDDR3 (933MHz) | 64-bit dual-channel (2x32bit)[9] | N/A | Dual SIM LTE Cat.6 (300Mbit/s) | N/A | N/A | Q2 2016 | List
| |
Kirin 655 | 2.12 (4xA53) 1.7 (4xA53) | N/A | N/A | N/A | Q4 2016 | List
| ||||||||||
Kirin 658 | 2.36 (4xA53) 1.7 (4xA53) | N/A | N/A | N/A | Q2 2017 | List
|
Kirin 910 and 910T
Model Number | Fab | CPU | GPU | Memory Technology | Nav | Wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
Kirin 910 | 28 nm HPM | ARMv7 | Cortex-A9 | 4 | 1.6 | Mali-450 MP4 | 533 MHz
(32GFlops) |
LPDDR3 | 32-bit single-channel | 6.4 | N/A | LTE Cat.4 | N/A | N/A | H1 2014 | |
Kirin 910T | 1.8 | 700 MHz
(41.8GFlops) |
N/A | N/A | N/A | H1 2014 | List
|
Kirin 920, 925 and 928
• The Kirin 920 SoC also contains an image processor that supports up to 32 megapixel
Model Number | Fab | CPU | GPU | Memory Technology | Nav | Wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
Kirin 920 | 28 nm HPM | ARMv7 | Cortex-A15 Cortex-A7 big.LITTLE | 4+4 | 1.7 (A15) 1.3 (A7) |
Mali-T628 MP4 | 600 MHz
(76.8GFlops) |
LPDDR3 (1600 MHz) | 64-bit dual-channel | 12.8 | N/A | LTE Cat.6 (300Mbit/s) | N/A | N/A | H2 2014 | List
|
Kirin 925 | 1.8 (A15) 1.3 (A7) |
N/A | N/A | N/A | Q3 2014 | List
| ||||||||||
Kirin 928 | 2.0 (A15) 1.3 (A7) |
N/A | N/A | N/A | N/A | List
|
Kirin 930 and 935
• supports - SD 3.0 (UHS-I) / eMMC 4.51 / Dual-band a/b/g/n Wi-Fi / Bluetooth 4.0 Low Energy / USB 2.0 / 32 MP ISP / 1080p video encode
Model Number | Fab | CPU | GPU | Memory Technology | Nav | Wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
Kirin 930 | 28 nm HPC | ARMv8-A | Cortex-A53 Cortex-A53 |
4+4 | 2.0 (A53) 1.5 (A53) |
Mali-T628 MP4 | 600 MHz
(76.8GFlops) |
LPDDR3 (1600 MHz) | 64-bit(2x32-bit) Dual-channel | 12.8 GB/s | N/A | Dual SIM LTE Cat.6 (DL:300Mbit/s UP:50Mbit/s) | N/A | N/A | Q1 2015 | List
|
Kirin 935 | 2.2 (A53) 1.5 (A53) |
680 MHz
(87GFlops) |
N/A | N/A | N/A | Q1 2015 | List
|
Kirin 950 and 955
• supports - SD 4.1 (UHS-II) / UFS 2.0 / eMMC 5.1 / MU-MIMO 802.11ac Wi-Fi / Bluetooth 4.2 Smart / USB 3.0 / NFS / Dual ISP (42 MP) / Native 10-bit 4K video encode / i5 coprocessor / Tensilica HiFi 4 DSP
Model Number | Fab | CPU | GPU | Memory Technology | Nav | Wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
Kirin 950 | TSMC 16 nm FinFET+[14] | ARMv8-A | Cortex-A72 Cortex-A53 big.LITTLE |
4+4 | 2.3 (A72) 1.8 (A53) |
Mali-T880 MP4 | 900 MHz
(122.4GFlops) |
LPDDR4 | 64-bit(2x32-bit) Dual-channel | 25.6 | N/A | Dual SIM LTE Cat.6 | N/A | N/A | Q4 2015 | List
|
Kirin 955[16] | 2.5 (A72) 1.8 (A53) |
LPDDR3 (3 GB) LPDDR4 (4 GB) | N/A | N/A | N/A | Q2 2016 | List
|
Kirin 960
- Interconnect: ARM CCI-550, Storage: UFS 2.1, eMMC 5.1
Model Number | Fab | CPU | GPU | Memory Technology | Nav | Wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
Kirin 960[17] | TSMC 16 nm FFC | ARMv8-A | Cortex-A73 Cortex-A53 big.LITTLE |
4+4 | 2.362 (A73) 1.844 (A53) |
Mali-G71 MP8 | 1037 MHz
(282GFlops) |
LPDDR4-1800 | 64-bit(2x32-bit) Dual-channel | 29.8 | N/A | Dual SIM LTE Cat.12 LTE 4x CA, 4x4 MIMO | N/A | N/A | Q4 2016 | List
|
Similar platforms
- R-Car by Renesas
- Tegra by Nvidia
- OMAP by Texas Instruments
- Exynos by Samsung
- Snapdragon by Qualcomm
- Ax by Apple
- Atom by Intel
- i.MX by Freescale Semiconductor
- RK3xxx by Rockchip
- Allwinner Axy by AllWinner
- MTxxxx by MediaTek
References
- ↑ HiSilicon Licenses ARM Technology for use in Innovative 3G/4G Base Station, Networking Infrastructure and Mobile Computing Applications, 02 August 2011 on ARM.com
- ↑ "HiSilicon Technologies Co., Ltd. 海思半导体有限公司". ARM Holdings. Retrieved 26 April 2013.
- ↑ ARM Launches Cortex-A50 Series, the World’s Most Energy-Efficient 64-bit Processors on ARM.com
- ↑ Lai, Richard. "Huawei's HiSilicon K3V3 chipset due 2H 2013, to be based on Cortex-A15". Engadget. Retrieved 26 April 2013.
- ↑ "Hisilicon grown into the largest local IC design companies". Windosi. September 2012. Retrieved 26 April 2013.
- ↑ brightsideofnews.com: Huawei U9510 Ascend D Quad XL Benchmarked on ARMdevices.net
- ↑ Huawei introduces quad-core 10 inch tablet with 1080p display on Liliputing.com
- ↑ Hands On with the Huawei Ascend W1, Ascend D2, and Ascend Mate on Anandtech
- ↑ "HiSilicon Kirin 650 SoC - Benchmarks and Specs". www.notebookcheck.net. Retrieved 2017-02-04.
- ↑ "Huawei MediaPad X1". DeviceSpecifications. Archived from the original on 23 July 2014. Retrieved 14 March 2014.
- ↑ "Huawei P6 S". Huawei. Retrieved 12 June 2014.
- ↑ "Huawei MediaPad M1". DeviceSpecifications. Archived from the original on 29 April 2015. Retrieved 14 March 2014.
- ↑ "Huawei Honor 6". DeviceSpecifications. Retrieved 25 June 2014.
- ↑ Huawei Ascend Mate 8/Honor 7’s Kirin 940/950 Processor Performance & Specs
- ↑ "HUAWEI MediaPad M3 8.0". Huawei-Consumer. Huawei. Retrieved 18 January 2017.
- ↑ Kirin 955, Huawei P9, P9 Plus
- ↑ "Huawei announces the HiSilicon Kirin 960: 4xA73 + 4xA53, G71MP8, CDMA". AnandTech. 2016-10-19.