Solder ball
In integrated circuit packaging, a solder ball, also a solder bump (ofter referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules.[1] The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux.[2]
A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability.[3]
Usage in flip chip method
Pads
Balls
Alignment
Contact
Solder reflow
Adhesive underfill
Final result
See also
- Head in pillow defect, a solder ball failure
References
- ↑ Definition of: solder ball, PC Magazine glossary
- ↑ Soldering 101 - A Basic Overview
- ↑ Patent US 7622325 B2, prior art description
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