Oxalyl fluoride
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| Names | |||
|---|---|---|---|
| IUPAC name
Oxalyl difluoride | |||
| Other names
Oxalyl fluoride, ethanedioyl difluoride | |||
| Identifiers | |||
359-40-0  | |||
| ChemSpider | 9287  | ||
| EC number | 206-630-4 | ||
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| Jmol-3D images | Image | ||
| PubChem | 9668 | ||
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| Properties | |||
| C2F2O2 | |||
| Molar mass | 94.017 g/mol | ||
| Melting point | −3 °C (27 °F; 270 K) | ||
| Boiling point | 26.6 °C (79.9 °F; 299.8 K) | ||
| Except where noted otherwise, data is given for materials in their standard state (at 25 °C (77 °F), 100 kPa) | |||
| verify (what is: /?) | |||
| Infobox references | |||
Oxalyl fluoride is a fluorinated derivative of oxalic acid. It is being investigated for use in etching as a replacement for compounds which have the liability of high global warming potential.[1][2]
See also
- Oxalyl chloride
- Oxalyl bromide
- Dioxane tetraketone
- Oxalyl
References
- ↑ Method of etching and cleaning using fluorinated carbonyl compounds, US Patent 6635185.
- ↑ Simon Karecki, Ritwik Chatterjee, Laura Pruette, Rafael Reif, Terry Sparks, Laurie Beu, Victor Vartanian, and Konstantin Novoselovc (2001). "Evaluation of Oxalyl Fluoride for a Dielectric Etch Application in an Inductively Coupled Plasma Etch Tool". J. Electrochem. Soc. 148 (3): G141–G149. doi:10.1149/1.1348263.