Organic Solderability Preservative
Organic Solderability Preservative, or OSP is a method for Coating printed circuit boards. It uses a water-based organic compound that selectively bonds to copper and protects the copper until soldering.
Organic Solderability Preservative, or OSP is a method for Coating printed circuit boards. It uses a water-based organic compound that selectively bonds to copper and protects the copper until soldering.