MEMS thermal actuator
A MEMS thermal actuator is a micromechanical device that typically generates motion by thermal expansion amplification. A small amount of thermal expansion of one part of the device translates to a large amount of deflection of the overall device. Usually fabricated out of doped Single Crystal Silicon or Polysilicon as a complex compliant member, the increase in temperature can be achieved internally by electrical resistive heating or externally by a heat source capable of locally introducing heat. Microfabricated thermal actuators can be integrated into micromotors.[1][2]
Types of thermal actuators
Other types of MEMS Actuators
- Electrostatic — parallel plate or comb drive
- Magnetic
- Piezoelectric
References
- ↑ Park, J.S.; Chu, L.L.; Oliver, A.D.; Gianchandani, Y.B. (2001). "Bent-beam electrothermal actuators-Part II: Linear and rotary microengines". Journal of Microelectromechanical Systems 10 (2): 255–262. doi:10.1109/84.925774.
- ↑ Maloney, J.M.; Schreiber, D.S.; DeVoe, D.L. (2004). "Large-force electrothermal linear micromotors". J. Micromech. Microeng. 14 (2): 226. doi:10.1088/0960-1317/14/2/009.
- ↑ Guckel, H.; Klein, J.; Christenson, T.; Skrobis, K.; Laudon, M.; Lovell, E.G. (1992). "Thermo-magnetic metal flexure actuatorsThermo-magnetic metal flexure actuators". Solid-State Sensor and Actuator Workshop, 1992. 5th Technical Digest. pp. 73–75. doi:10.1109/SOLSEN.1992.228273.
- ↑ Comtois, J.; Bright, V. (1996). "Surface Micromachined Polysilicon Thermal Actuator Arrays and Applications". Technical Digest, 1996 Solid State Sensors and Actuators Workshop. pp. 174–7.
- ↑ Que, L.; Park, J.-S.; Gianchandani, Y.B. (1999). "Bent-beam electro-thermal actuators for high force applications". Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on. pp. 31–36. doi:10.1109/MEMSYS.1999.746747.
- ↑ Sinclair, M.J. (2000). "A high force low area MEMS thermal actuator". Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on. doi:10.1109/ITHERM.2000.866818.