TO-126
From Wikipedia, the free encyclopedia
TO-126 is a type of semiconductor package for devices with three pins, such as transistors.[1] The package is rectangular with a hole in the middle to allow for easy mounting and/or heatsinking.
History and origin
The JEDEC TO-126 descriptor is derived from the original full name for the package: Transistor Outline Package, Case Style 126. In the updated JEDEC outline system, the package is numbered as TO-225AA.[2]
See also
- Chip carrier Chip packaging and package types list
References
- ↑ BD135; BD137; BD139; NPN power transistors, Philips Semiconductors, 1999, retrieved 2013-12-09
- ↑ AN1040/D: Mounting Considerations For Power Semiconductors, On Semiconductor, 2001, retrieved 2014-01-25
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