Gallium nitride

Gallium nitride
Identifiers
CAS number 25617-97-4 Y
PubChem 117559
ChemSpider 105057 Y
RTECS number LW9640000
Jmol-3D images Image 1
Properties
Molecular formula GaN
Molar mass 83.73 g/mol
Appearance yellow powder
Density 6.15 g/cm3
Melting point

>2500°C[2]

Solubility in water Reacts.
Band gap 3.4 eV (300 K, direct)
Electron mobility 440 cm2/(V·s) (300 K)
Thermal conductivity 2.3 W/(cm·K) (300 K) [1]
Refractive index (nD) 2.429
Structure
Crystal structure Wurtzite
Space group C6v4-P63mc
Lattice constant a = 3.186 Å, c = 5.186 Å [3]
Coordination
geometry
Tetrahedral
Hazards
EU Index Not listed
Flash point Non-flammable.
Related compounds
Other anions Gallium phosphide
Gallium arsenide
Gallium antimonide
Other cations Boron nitride
Aluminium nitride
Indium nitride
Related compounds Aluminium gallium arsenide
Indium gallium arsenide
Gallium arsenide phosphide
Aluminium gallium nitride
Indium gallium nitride
 Y (verify) (what is: Y/N?)
Except where noted otherwise, data are given for materials in their standard state (at 25 °C, 100 kPa)
Infobox references

Gallium nitride (GaN) is a binary III/V direct bandgap semiconductor commonly used in bright light-emitting diodes since the 1990s. The compound is a very hard material that has a Wurtzite crystal structure. Its wide band gap of 3.4 eV affords it special properties for applications in optoelectronic, high-power and high-frequency devices. For example, GaN is the substrate which makes violet (405 nm) laser diodes possible, without use of nonlinear optical frequency-doubling.

Its sensitivity to ionizing radiation is low (like other group III nitrides), making it a suitable material for solar cell arrays for satellites. Military and space applications could also benefit as devices have shown stability in radiation environments.[4] Because GaN transistors can operate at much hotter temperatures and work at much higher voltages than gallium arsenide (GaAs) transistors, they make ideal power amplifiers at microwave frequencies.

Contents

Physical properties

GaN is a very hard, mechanically stable wide bandgap semiconductor material with high heat capacity and thermal conductivity.[5] In its pure form it resists cracking and can be deposited in thin film on sapphire or silicon carbide, despite the mismatch in their lattice constants.[5] GaN can be doped with silicon (Si) or with oxygen[6] to n-type and with magnesium (Mg) to p-type;[7] however, the Si and Mg atoms change the way the GaN crystals grow, introducing tensile stresses and making them brittle.[8] Gallium nitride compounds also tend to have a high spatial defect frequency, on the order of a hundred million to ten billion defects per square centimeter.[9]

Developments

High crystalline quality GaN can be obtained by low temperature deposited buffer layer technology.[10] This high crystalline quality GaN led to the discovery of p-type GaN,[7] p-n junction blue/UV-LEDs[7] and room-temperature stimulated emission[11] (indispensable for laser action).[12] This has led to the commercialization of high-performance blue LEDs and long-lifetime violet-laser diodes, and to the development of nitride-based devices such as UV detectors and high-speed field-effect transistors.

High-brightness GaN light-emitting diodes (LEDs) completed the range of primary colors, and made applications such as daylight visible full-color LED displays, white LEDs and blue laser devices possible. The first GaN-based high-brightness LEDs were using a thin film of GaN deposited via MOCVD on sapphire. Other substrates used are zinc oxide, with lattice constant mismatch only 2%, and silicon carbide (SiC).[13] Group III nitride semiconductors are in general recognized as one of the most promising semiconductor family for fabricating optical devices in the visible short-wavelength and UV region.

The very high breakdown voltages,[14] high electron mobility and saturation velocity of GaN has also made it an ideal candidate for high-power and high-temperature microwave applications, as evidenced by its high Johnson's Figure of Merit. Potential markets for high-power/high-frequency devices based on GaN include microwave radio-frequency power amplifiers (such as used in high-speed wireless data transmission) and high-voltage switching devices for power grids. A potential mass-market application for GaN-based RF transistors is as the microwave source for microwave ovens, replacing the magnetrons currently used. The large band gap means that the performance of GaN transistors is maintained up to higher temperatures than silicon transistors. The first gallium nitride metal/oxide semiconductor field-effect transistors (GaN MOSFET) were experimentally demonstrated in 1993[15] and they are being actively developed.

Gallium nitride doped with small amounts of antimony (Sb) has been proposed on theoretical grounds as being capable of catalyzing the splitting of water into H2 and O2 using sunlight.[16]

In 2010 the first enhancement mode gallium nitride transistors became generally available.[17] These devices were designed to replace power MOSFETs in applications where switching speed or power conversion efficiency is critical. These transistors, also called eGaN® FETs, are built by growing a thin layer of GaN on top of a standard silicon wafer. This allows the eGaN FETs to maintain costs similar to silicon power MOSFETs, but with the superior electrical performance GaN.

Applications

GaN-based violet laser diodes are used to read Blu-ray Discs. When doped with a suitable transition metal such as manganese, GaN is a promising spintronics material (magnetic semiconductors). The mixture of GaN with In (InGaN) or Al (AlGaN) with a band gap dependent on ratio of In or Al to GaN allows the manufacture of light-emitting diodes (LEDs) with colors that can go from red to blue.[13]

GaN HEMTs have been offered commercially since 2006, and have found immediate use in various wireless infrastructure applications due to their high efficiency and high voltage operation. Second generation technology with shorter gate lengths will be addressing higher frequency telecom and aerospace applications.[18] GaN based MOSFET and MESFET transistors also offer many advantages in high power electronics, especially in automotive and electric car applications.[19] Nanotubes of GaN are proposed for applications in nanoscale electronics, optoelectronics and biochemical-sensing applications[20]

They are also useful in military electronics such as Active Electronically Scanned Array radars.[21]

GaN has been found to be biocompatable.[22] This may lead to implants of electrodes and electronics in living organisms.

Synthesis

Bulk substrates

GaN crystals can be grown from a molten Na/Ga melt held under 100 atm pressure of N2 at 750 °C. As Ga will not react with N2 below 1000 °C, the powder must be made from something more reactive, usually in one of the following ways:

2 Ga + 2 NH3 → 2 GaN + 3 H2
Ga2O3 + 2 NH3 → 2 GaN + 3 H2O

Molecular beam epitaxy

Commercially, GaN crystals can be grown using molecular beam epitaxy. This process can be further modified to reduce dislocation densities. First, an ion beam is applied to the growth surface in order to create nanoscale roughness. Then, the surface is polished. This process takes place in a vacuum.

Safety

GaN dust is an irritant to skin, eyes and lungs. The environment, health and safety aspects of gallium nitride sources (such as trimethylgallium and ammonia) and industrial hygiene monitoring studies of MOVPE sources have been reported recently in a review.[23]

GaN has been found to be non-toxic.[22]

See also

References

  1. ^ Mion, Christian. "Investigation of the Thermal Properties of Gallium Nitride Using the Three Omega Technique." Diss. North Carolina State University. Raleigh, 2005. Web, Aug 12, 2011. http://repository.lib.ncsu.edu/ir/bitstream/1840.16/5418/1/etd.pdf.
  2. ^ T. Harafuji and J. Kawamura (2004). "Molecular dynamics simulation for evaluating melting point of wurtzite-type GaN crystal". Appl. Phys. 96 (5): 2501. doi:10.1063/1.1772878. 
  3. ^ Bougrov V., Levinshtein M.E., Rumyantsev S.L., Zubrilov A., in Properties of Advanced Semiconductor Materials GaN, AlN, InN, BN, SiC, SiGe. Eds. Levinshtein M.E., Rumyantsev S.L., Shur M.S., John Wiley & Sons, Inc., New York, 2001, 1–30
  4. ^ Alexander Lidow, J. Brandon Witcher, Ken Smalley (March 2011). "Enhancement Mode Gallium Nitride (eGaN) FET Characteristics under Long Term Stress". GOMAC Tech Conference. http://epc-co.com/epc/documents/articles/eGaN_FET_Characteristics_under_Long_Term_Stress.pdf. 
  5. ^ a b Isamu Akasaki and Hiroshi Amano (1997). "Crystal Growth and Conductivity Control of Group III Nitride Semiconductors and Their Application to Short Wavelength Light Emitters". Jpn. J. Appl. Phys. 36: 5393–5408. doi:10.1143/JJAP.36.5393. 
  6. ^ Information Bridge: DOE Scientific and Technical Information – Document #434361
  7. ^ a b c Hiroshi Amano, Masahiro Kito, Kazumasa Hiramatsu and Isamu Akasaki (1989). "P-Type Conduction in Mg-Doped GaN Treated with Low-Energy Electron Beam Irradiation (LEEBI)". Jpn. J. Appl. Phys. 28: L2112–L2114. doi:10.1143/JJAP.28.L2112. 
  8. ^ Shinji Terao, Motoaki Iwaya, Ryo Nakamura, Satoshi Kamiyama, Hiroshi Amano and Isamu Akasaki (2001). "Fracture of AlxGa1-xN/GaN Heterostructure —Compositional and Impurity Dependence". Jpn. J. Appl. Phys. 40: L195–L197. doi:10.1143/JJAP.40.L195. 
  9. ^ lbl.gov, blue-light-diodes
  10. ^ H. Amano et al. (1986). "Metalorganic vapor phase epitaxial growth of a high quality GaN film using an AlN buffer layer". Applied Physics Letters 48 (5): 353. doi:10.1063/1.96549. http://link.aip.org/link/?APL/48/353. 
  11. ^ Hiroshi Amano, Tsunemori Asahi and Isamu Akasaki (1990). "Stimulated Emission Near Ultraviolet at Room Temperature from a GaN Film Grown on Sapphire by MOVPE Using an AlN Buffer Layer". Jpn. J. Appl. Phys. 29: L205–L206. doi:10.1143/JJAP.29.L205. 
  12. ^ Isamu Akasaki, Hiroshi Amano, Shigetoshi Sota, Hiromitsu Sakai, Toshiyuki Tanaka and Masayoshi Koike (1995). "Stimulated Emission by Current Injection from an AlGaN/GaN/GaInN Quantum Well Device". Jpn. J. Appl. Phys. 34: L1517–L1519. doi:10.1143/JJAP.34.L1517. 
  13. ^ a b Morkoç, H.; Strite, S.; Gao, G. B.; Lin, M. E.; Sverdlov, B.; Burns, M. (1994). "Large-band-gap SiC, III-V nitride, and II-VI ZnSe-based semiconductor device technologies". Journal of Applied Physics 76 (3): 1363. doi:10.1063/1.358463. 
  14. ^ Yuvaraj Dora,; Chakraborty, Arpan; McCarthy, Lee; Keller, Stacia; DenBaars, Stephen; Mishra, Umesh (2006). "High Breakdown Voltage Achieved on AlGaN/GaN HEMTs With Integrated Slant Field Plates". IEEE Electron Device Letters 27 (9): 713. doi:10.1109/LED.2006.881020. 
  15. ^ Asif Khan, M.; Kuznia, J. N.; Bhattarai, A. R.; Olson, D. T. (1993). "Metal semiconductor field effect transistor based on single crystal GaN". Applied Physics Letters 62 (15): 1786. doi:10.1063/1.109549. 
  16. ^ R. Michael Sheetz; Richter, Ernst; Andriotis, Antonis N.; Lisenkov, Sergey; Pendyala, Chandrashekhar; Sunkara, Mahendra K.; Menon, Madhu (2011). "Visible-light absorption and large band-gap bowing of GaN1−x Sbx from first principles". Physical Review B 84: 075304–1. doi:10.1103/PhysRevB.84.07530. 
  17. ^ Davis, Sam (March 2010). "Enhancement Mode GaN MOSFET Delivers Impressive Performance". Power Electronic Technology. 3 36. 
  18. ^ 2010 IEEE Intl. Symposium, Technical Abstract Book, Session TH3D, pp. 164–165
  19. ^ SiC and GaN Vie for Slice of the Electric Vehicle Pie. Powerelectronics. November 1, 2009
  20. ^ Goldberger et al.; He, R; Zhang, Y; Lee, S; Yan, H; Choi, HJ; Yang, P (2003). "Single-crystal gallium nitride nanotubes". Nature 422 (6932): 599–602. doi:10.1038/nature01551. PMID 12686996. 
  21. ^ "Gallium Nitride-Based Modules Set New 180-Day Standard For High Power Operation." Northrop Grumman, 13 April 2011.
  22. ^ a b "Research Finds Gallium Nitride is Non-Toxic, Biocompatible – Holds Promise For Biomedical Implants" North Carolina State University http://news.ncsu.edu/releases/wmsivanisevicganpeptides/
  23. ^ Shenaikhatkhate, D; Goyette, R; Dicarlojr, R; Dripps, G (2004). "Environment, health and safety issues for sources used in MOVPE growth of compound semiconductors". Journal of Crystal Growth 272: 816. Bibcode 2004JCrGr.272..816S. doi:10.1016/j.jcrysgro.2004.09.007. 

Further reading

External links