Via (electronics)

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Different types of vias (1 through hole, 2 blind via, 3 buried via)
Different types of vias (1 through hole, 2 blind via, 3 buried via)

In printed circuit board design, via refers to a pad with a plated hole that connects copper tracks from one layer of the board to other layer(s). Either the holes are electroplated or small rivets are inserted. High-density multi-layer PCBs may have blind vias, which are visible only on one surface, or buried vias, which are visible on neither (example image of each).

In integrated circuit design, a via is a small opening in an insulating oxide layer that allows metallic interconnect on different interconnect layers to form a connection. A via on an integrated circuit is often called a through-chip via.

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