Image:Trench doubling.JPG

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[edit] Summary

The basic process for doubling trenches or holes.

  • Top: Photoresist is coated over the starting trench or hole pattern.
  • Center: Holes or trenches are exposed and etched into the underlying layer.
  • Bottom: Photoresist is removed, leaving the sum of the previous and new patterns.

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current09:19, 8 March 2008393×488 (11 KB)Guiding light (Talk | contribs) (The basic process for doubling trenches or holes. Top: Photoresist is coated over the starting trench or hole pattern. Center: Holes or trenches are exposed and etched into the underlying layer. Bottom: Photoresist is removed, leaving the sum of the prev)

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