Thin small-outline package

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An outline drawing of a Type I TSOP with 32 leads

Thin small-outline packages, or TSOPs are a type of surface mount IC package. They are notably very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).

They are frequently used for RAM or Flash memory ICs dues to their high pin count and small volume. However, they are being supplanted by ball grid array packages which can achieve even higher densities.

1 Physical properties
- 1.1 Type I
- 1.2 Type II
2 Similar packages
3 See also
4 External links

[edit] Physical properties

TSOPs are rectangular in shape and come in two varieties: Type I and Type II. Type I ICs have the pins on the shorter side and Type II have the pins on the longer side. The table below shows basic measurements for common TSOP packages.

[edit] Type I

Part Number	Pins	Body Width/mm	Body Length/mm	Lead Pitch/mm
TSOP28	28	8.1	11.8	0.55
TSOP28/32	28/32	8	18.4	0.5
TSOP40	40	10	18.4	0.5
TSOP48	48	12	18.4	0.5

[edit] Type II

Part Number	Pins	Body Width/mm	Body Length/mm	Lead Pitch/mm
TSOP20/24/26	20/24/26	7.6	17.14	1.27
TSOP24/28	24/28	10.16	18.41	1.27
TSOP32	32	10.16	20.95	1.27
TSOP40/44	40/44	10.16	18.42	0.8
TSOP50	50	10.16	20.95	0.8
TSOP54	54	10.16	22.22	0.8
TSOP66	66	10.16?	22.22	0.65