Thermal interface material

From Wikipedia, the free encyclopedia

A Thermal Interface Material or Mastic (aka TIM) is used to fill the gaps between thermal transfer surfaces, such as between microprocessors and heatsinks, in order to increase thermal transfer efficiency. These gaps are normally filled with air which is a very poor conductor.

They take many forms. The most common is the white-colored paste or thermal grease, typically silicone oil filled with aluminum oxide, zinc oxide, or boron nitride. Some brands of thermal interfaces use micronized or pulverized silver.

Another type of TIM are the phase-change materials. These are solid at room temperature but liquefy and behave like grease at operating temperatures. They are easy to handle and are not messy.

[edit] External links

AI Technology - Compressible Phase Change Thermal Interface Materials
Bergquist - Thermal Interface Materials
EIS - Thermal Interface Materials
Fraivillig Technologies - Thermal Interface Materials
Fujipoly - Thermal Interface Materials Product Line=Sarcon_Thermal_Interface_Materials
Laird Technologies - Complete line of Phase Change Materials, Thermal Grease, Gap Fillers, and Thermally Conductive Insulators
Powersites - Thermal Interface Materials

Take note that some cpu's should have thermal paste applied and some should not. AMD has a white paper about this in regard of their own cpu's: http://www.amd.com/us-en/assets/content_type/white_papers_and_tech_docs/26951.pdf