Talk:Sputtering
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I restructured the article since there was confusion between the sputtering process and its applications (which are articles in themselves such as sputter deposition, ion milling, reactive ion etching etcetera). Some images and graphs should be added soon as well. Since this edit takes care of several suggestions I removed those from the talk page to keep the page clean.
—Maybe someone should put in a reactive sputtering section. I know a little, but I might take a while to get around to it.--Joel 19:13, 11 May 2005
- no, that is part of sputter deposition
I agree, there is a misleading statement that sputtering always produces thin films with the same composition as the source material. This is not the case as lighter elements may be lost through the "sputering gas" in the diagram, a particular example of this is sputtering of non stoichiometric silicon oxide SiOx, where you can use various silicon compounds and contol the amount of oxygen by controling the flow of oxygen through the sputtering chamber.
- should be done in the sputter deposition article
[edit] Illustrations?
This article could use some illustrations.
Hello,
I'm new to Wikipedia and have had great help from user A.B. who has helped me get used to the etiquette of Wikipedia and has advised me to talk to you involved in this particular subject. I am part of a team at the forefront of the sputtering process I have added to this article (HiTUS) and will be adding content to other similar areas in due course. I look forward to being of assistance in due course on this subject and other topics closely linked to sputtering and thin film deposition.
[edit] Chemical sputtering, preferential sputtering
This article puts too much emphasis on 'chemical sputtering' which is basically reactive ion etching and not sputtering, since the process is not purely driven by momentum transfer. Reactive sputtering can be discussed in the deposition article. I would recommend deleting it all.
