Socket 370

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Socket 370
Specifications
Type PGA-ZIF
Chip form factors Plastic pin grid array (PPGA) and Flip-chip pin grid array (FC-PGA and FC-PGA2)
Contacts 370
Bus Protocol GTL+
FSB 66, 100 and 133 MHz
Voltage range 1.05–2.1 V
Processors Intel Celeron Mendocino (PPGA, 300–533 MHz, 2.0 V)

Intel Celeron Coppermine (FC-PGA, 533–1100 MHz, 1.5–1.75 V)
Intel Celeron Tualatin (FC-PGA2, 900–1400 MHz, 1.475–1.5 V)
Intel Pentium III Coppermine (FC-PGA, 500–1133 MHz, 1.6–1.75 V)
Intel Pentium III Tualatin (FC-PGA2, 1000–1400 MHz, 1.45–1.5 V)
VIA Cyrix III/C3 (500–1200 MHz, 1.35–2.0 V)
This article is part of the CPU socket series

Socket 370 (also known as the PGA370 socket) is a common format of CPU socket first used by Intel for Pentium III and Celeron processors to replace the older Slot 1 CPU interface on personal computers. The "370" refers to the number of holes in the socket for CPU pins. Modern Socket 370 fittings are usually found on Mini-ITX motherboards and embedded systems.

Socket 370 was originally used for the Intel Celeron, but later became the socket/platform for the Coppermine and Tualatin Pentium III processors, as well as the Via-Cyrix Cyrix III, later renamed the VIA C3. Some motherboards that used Socket 370 support Intel processors in dual CPU configurations. Others allowed the use of a Socket 370 or Slot 1 CPU, although not at the same time.

The weight of a Socket 370 CPU cooler should not exceed 180 grams. Heavier coolers may result in damage to the die when the system is not properly handled.[citation needed]

This platform is not wholly obsolete, but its use is today limited to the above specialty applications, having been superseded by Socket 423/478/775 (for Pentium 4 and Core 2 processors). Via is at present still producing Socket 370 processors but committed to migrating their processor line to ball grid array packages.

Contents

[edit] Socket 370 Intel processors mechanical load limits

Most Intel Socket 370 processors (Pentium III and Celeron) have the following mechanical maximum load limits which should not be exceeded during heat sink assembly, shipping conditions, or standard use. Load above those limits will crack the processor die and make it unusable.

Location Dynamic Static
Die Surface 890 N (200 lbf) 222 N (50 lbf)
Die Edge 667 N (100 lbf) 53 N (12 lbf)

Those load limits are quite small compared to the load limits of Socket 478 processors. Indeed they were so small that many users ended up with cracked processors while trying to remove or attach a heatsink to their processor. On the other hand, Socket A processors had even smaller load limits.

[edit] Socket 370 Intel processors with IHS mechanical load limits

All Intel Socket 370 processors with IHS (Pentium III and Celeron 1.13–1.4 GHz) have the following mechanical maximum load limits which should not be exceeded during heatsink assembly, shipping conditions, or standard use.Load above those limits will crack the processor die and make it unusable.

Location Dynamic Static
IHS Surface 890 N (200 lbf) 667 N (100 lbf)
IHS Edge 556 N (125 lbf) N/A
IHS Corner 334 N (75 lbf) N/A

[edit] Support Socket 370 Intel processors chipset information

[edit] Intel

  • i440/450 chipset series
i440BX/EX/FX/GX/LX/MX/MX-100/ZX, i450GX/KX/NX
  • i8XX chipset series
i810/E/E2/L, i815/E/EG/EP/G/P, i820E, i840

[edit] VIA

  • Apollo/Apollo Pro/Apollo Pro+
  • PRO133/PRO133A/Pro133T/PM133/PN133/PN133T/PL133/PL133T/PLE133/PLE133T
  • Pro266/PM266/Pro266T/PM266T
  • CLE266/CN400

[edit] ALi

  • Aladdin Pro/ProII/TNT2/Pro 4/Pro 5/Pro 5T

[edit] ATi

  • S1-370-TL

[edit] OPTi

  • Discovery

[edit] SiS

  • SiS 5600
  • SiS 620, SiS 630/E/ET/S/ST, SiS 633/T, SiS 635/T

[edit] ULi

  • M1644T

[edit] External links