QFN
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A QFN or Quad Flat No leads package is an integrated circuit package used with surface mounted printed circuit boards. This kind of package is similar to the Quad Flat Package, but the leads do not extend out from the sides of the package; instead, the contacts are on the bottom.
[edit] Different Types of QFNs:
There are currently two general types of QFN packages in the market; an Air-Cavity QFN with air within the package, and a fully encapsulated Plastic-Moulded QFN with minimal air voids and no cavity within the package.
Each type of QFN has its own use. Due to its structure, the plastic-moulded QFN is usually limited to applications up to ~2-3GHz. It is usually composed of just 2 parts, a plastic compound and copper leadframe, and does not come with a lid.
In contrast, the Air-Cavity QFN is usually made up of 3 parts; a copper leadframe, plastic-moulded body (open, and not sealed), and either a ceramic or plastic lid. It is usually more expensive due to its construction, and can be used for microwave applications up to 20-25GHz.
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