Micro-FCBGA

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Specifications
Micro-FCBGA
http://support.intel.com/support/processors/procid/pix/FCBGABottom.jpg
Type	BGA
Chip form factors	Ball grid array
Contacts	479
Bus Protocol	GTL+, AGTL+
FSB	133 MHz 100 MHz QDR (400 effective) 133 MHz QDR (533 effective) 167 MHz QDR (667 effective) 200 MHz QDR (800 effective)
Voltage range	0.750 - 1.70 V
Processors	Intel Core 2 Duo mobile (1.06 GHz-2.40 GHz) Intel Core Duo (1.06 GHz-2.33 GHz) Intel Core 2 Solo (1.06 GHz-1.2 GHz) Intel Core Solo (1.06 GHz-1.83 GHz) Intel Pentium M (900 MHz-2.13 GHz) Intel Celeron M (600 MHz-1.70 GHz) Intel Pentium III mobile (1.06 GHz) Intel Mobile Celeron (733 MHz-933 MHz)
This article is part of the CPU socket series

Micro-FCBGA (Flip Chip Ball Grid Array) is Intel's current BGA mounting method for mobile processors that use a flip chip binding technology. It was introduced with the Coppermine Mobile Celeron and replaces the older BGA2 ball-grid-array mounting method used in the Coppermine Pentium III mobile CPUs. Micro-FCBGA has 479 balls that are 0.78 mm in diameter and arranged similarly to the pins in a pin grid array. The processor is affixed to the motherboard by soldering the balls to the motherboard. This allows for a much thinner CPU/interface profile than a pin grid array socket arrangement, but the micro-FCBGA chip is not removable from the motherboard. Micro-FCBGA is commonly used to mount ultra-low-voltage and low-voltage versions of mobile CPUs to the motherboard, likely due to its much thinner profile fitting better in the very thin sub-notebooks that those CPUs are usually used in. However, standard-voltage versions of the CPUs also occasionally use a micro-FCBGA interface instead of a pin grid array socket.