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[edit] Surface-mount dimension reference
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C Clearance between IC body and PCB
H Total Height
T Lead Thickness
L Total Carrier Length
LW Lead Width
LL Lead Length
P Pitch
WB IC Body Width
WL Lead-to-Lead Width
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[edit] Through pin dimension reference
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C Clearance between IC body and board
H Total Height
T Lead Thickness
L Total Carrier Length
LW Lead Width
LL Lead Length
P Pitch
WB IC Body Width
WL Lead-to-Lead Width
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[edit] Table of chip dimensions
All measurements below are given in mm.
| Image |
Family |
Name |
Package |
WB |
WL |
H |
C |
L |
P |
LL |
T |
LW |
|
CLCC |
Ceramic Leadless Chip Carrier |
48 CLCC |
14.22 |
14.22 |
2.21 |
|
14.22 |
1.016 |
NA |
|
0.508 |
 |
DIP |
Dual In-line Package |
DIP-8 |
6.2-6.48 |
7.62 |
7.7 |
|
9.2-9.8 |
2.54 |
3.05-3.6 |
|
1.14-1.73 |
| DIP-32 |
|
15.24 |
|
|
|
2.54 |
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|
|
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LFCSP |
Lead Frame Chip Scale Package |
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|
|
|
0.5 |
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MSOP |
Mini Small Outline Package |
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|
0.5 |
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 |
SOIC (SO, SOP) |
Small-outline integrated circuit (package) |
SOIC-8 |
3.9 |
5.8-6.2 |
1.72 |
0.10-0.25 |
4.8-5.0 |
1.27 |
1.05 |
0.19-0.25 |
0.39-0.46 |
| SOIC-14 |
3.9 |
5.8-6.2 |
1.72 |
0.10-0.25 |
8.55-8.75 |
1.27 |
1.05 |
0.19-0.25 |
0.39-0.46 |
| SOIC-16 |
3.9 |
5.8-6.2 |
1.72 |
0.10-0.25 |
9.9-10 |
1.27 |
1.05 |
0.19-0.25 |
0.39-0.46 |
| SOIC-16 |
7.5 |
10.00-10.65 |
2.65 |
0.10-0.30 |
10.1-10.5 |
1.27 |
1.4 |
0.23-0.32 |
0.38-0.40 |
 |
SOT |
Small Outline Transistor (even if chip does not function as a transistor) |
SOT-23-8 |
1.6 |
2.8 |
1.45 |
|
2.9 |
0.65 |
0.6 |
|
0.22-0.38 |
|
TDFN |
Thin Dual Flat No-Lead Plastic Package |
8-TDFN |
3 |
3 |
0.7-0.8 |
|
3 |
0.65 |
NA |
|
0.19-0.3 |
|
TSSOP |
Thin Shrink Small Outline Package |
|
|
|
|
|
|
0.65 |
|
|
0.19-0.3 |
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µSOP |
Micro Small Outline Package |
|
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|
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|
0.5 |
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 |
TQFP |
Thin Quad Flat Pack |
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[edit] Sources
