Talk:Integrated circuit packaging

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[edit] Standards body

A reference to the main standards organizations for packages would be helpful. JEDEC comes to mind. Are there others? In particular, it would be useful with a link to the actual standards.

Perhaps some popular packages are industry standards, rather than official standards. That should also be apparent in this article and articles about each particular package type. --HelgeStenstrom 12:44, 18 September 2007 (UTC)

[edit] Title

I would suggest changing the title from Integrated circuit packaging to Packaging_(microfabrication). This would allow us more general description of packages used for integrated circuits and microsystems. As some techniques from Integrated circuit packaging are used also in packages for MEMS, we could use more general title like Packaging_(microfabrication) to cover both topics IC and MEMS in one article. We could redirect Integrated circuit packaging to this more general site. What do you think? Twisp (talk) 23:39, 2 March 2008 (UTC)