Image:IC-221M temp graph.png
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[edit] Summary
| Description |
Yield Strength vs Temperature for Nickel Aluminide |
|---|---|
| Source |
INTERMETALLIC-BASED HIGH-TEMPERATURE MATERIALS, Oak Ridge Labs, U.S. D.O.E. |
| Date |
March 1999 |
| Author |
Vinod K. Sikka |
| Permission (Reusing this image) |
see below |
[edit] Licensing
 |
This work is in the public domain in the United States because it is a work of the United States Federal Government under the terms of Title 17, Chapter 1, Section 105 of the US Code. See Copyright.
Note: This only applies to works of the Federal Government and not to the work of any individual U.S. state, territory, commonwealth, county, municipality, or any other subdivision. العربية | Български | Česky | Deutsch | English | Español | Français | Magyar | Italiano | 日本語 | 한국어 | Polski | Português | 中文(繁體) | 中文(简体) | +/- |
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File history
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| Date/Time | Dimensions | User | Comment | |
|---|---|---|---|---|
| current | 15:17, 30 April 2008 | 584×470 (38 KB) | Cadwallader221 | ({{Information |Description= Yield Strength vs Temperature for Nickel Aluminide |Source= INTERMETALLIC-BASED HIGH-TEMPERATURE MATERIALS, Oak Ridge Labs, U.S. D.O.E. |Date= March 1999 |Author=Vinod K. Sikka |Permission= |other_versions= }} ) |
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