Hot-bar reflow
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Hot-bar reflow is a selective soldering process where two pre-fluxed, solder coated parts are heated with heating element (called a thermode) to a sufficient temperature to melt the solder.
Pressure is applied through the whole process (usually 15 s) to insure that components stay in place during cooling. The heating element is heated and cooled for each connection. Up to 4000 W can be used in the heating element allowing fast soldering, good results with connections requiring high energy. [1]
[edit] References
- ^ Unitek Eapro: Electronic Assembly Products. 070927 unitekeapro.com