Disco Corporation
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DISCO Corporation (株式会社ディスコ Kabushiki-gaisha Disuko?) (TYO: 6146) is a precision tools maker from Japan. The company was founded as Daiichi-Seitosho Co. Ltd. in May 1937, as an industrial abrasive wheels manufacturer.
In December 1968, it developed and released an ultra-thin resinoid cutting wheel, MICRON-CUT. As the cutting equipment at the time often caused damage to the abrasive wheels, the corporation moved into the market, releasing an automatic scriber and dicing saw in April 1975.
The company adopted the name of DISCO Corporation in May 1977, was listed with the Japan Securities Dealers' Association in October 1989, and entered the First Section of the Tokyo Stock Exchange in December 1999.
DISCO Corporation makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
