Die attachment
From Wikipedia, the free encyclopedia
Die attachment is the step during the integrated circuit packaging phase of semiconductor device fabrication during which a die is mounted and fixed to the package or support structure.
For high-powered applications, the die is usually eutectic bonded onto the package (for good heat conduction). For low-cost, low-powered applications, the die is often glued directly onto a substrate (such as a printed wiring board) using an epoxy adhesive.
