Centrino

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Components of the Centrino platform. From right, clockwise: Intel PRO/Wireless network adapter, Intel mobile processor, Intel mobile chipset (southbridge and northbridge).
Components of the Centrino platform. From right, clockwise: Intel PRO/Wireless network adapter, Intel mobile processor, Intel mobile chipset (southbridge and northbridge).

Centrino, a platform-marketing initiative from Intel, covers a particular combination of CPU, mainboard chipset and wireless network interface in the design of a laptop personal computer. Intel claimed that systems equipped with these technologies should deliver better performance, longer battery life and broad wireless network interoperability.

Contents

[edit] Marketing

Intel has reportedly invested US$300 million in Centrino advertising. Because of the ubiquity of the marketing campaign, many consumers mistakenly refer to Pentium M and Intel Core processors as "Centrinos". Many consumers have received the impression that only Centrino provides wireless connectivity in a laptop.

The Centrino marketing program has been widely assumed to be responsible for the success of Intel laptop PCs. However, findings of the Japanese FTC in March of 2005 indicate that the financial incentives associated with the Centrino program were used as illegal, anti-competitive practices by Intel to induce its customers not to buy laptop chips from Intel's long time rival AMD. In the quarter immediately following the JFTC ruling, AMD boasted more than 60 laptop computer design wins which was a strong resurgence from the [1] drastic share reductions seen in 2003 and 2004.

To qualify for a Centrino label, laptop vendors must use all three Intel qualified parts under each platform, otherwise using only the processor and chipset will carry the Pentium M, Pentium Dual-Core, Celeron, Intel Core or Intel Core 2 label instead.


[edit] Centrino Brand Names Updated

In order for a smooth platform transition over Centrino 2, and current confusion over Centrino logo, Intel had started to have brand names and logos changed for Napa and Santa Rosa notebook platforms in the second quarter of 2008 onwards. [1]

Intel Centrino technology family
Platform Carmel Sonoma Napa Santa Rosa Montevina Menlow
Logo Centrino Centrino Solo Yonah Centrino Duo Merom Centrino Solo Merom Centrino Duo Centrino Pro
New Logo Centrino Centrino Pro Centrino 2 Centrino 2 vPro Centrino Atom

[edit] Notebook implementations

[edit] Carmel platform (2003)

Original Centrino logo for Carmel and Sonoma platforms
Original Centrino logo for Carmel and Sonoma platforms

Intel used Carmel as the code-name for the first-generation Centrino platform, introduced in March 2003.

The Carmel platform consists of:

  • an Intel Pentium M processor (code-named Banias or later Dothan) with a 400 MT/s FSB, Socket 478 and
  • an Intel 855 series chipset (code-named Odem or Montara with Intel Extreme Graphics 2), DDR-266 and
  • an Intel PRO/Wireless 2100B or later 2200BG mini-PCI Wi-Fi adapter (code-named Calexico).

Industry-watchers initially criticized the Carmel platform for its lack of an IEEE 802.11g-solution, because many independent Wi-Fi chip-makers like Broadcom and Atheros had already started shipping 802.11g products. Intel responded that the IEEE had not finalized the 802.11g standard at the time of Carmel's launch, and that it did not want to launch products not based on a finalized standard. In early 2004, after the finalization of the 802.11g standard, Intel permitted an Intel PRO/Wireless 2200BG to substitute for the 2100. At the same time, they permitted the new Dothan Pentium M to substitute for the Banias Pentium M. Initially, Intel permitted only the 855GM chipset, which did not support external graphics. Later, Intel allowed the 855GME and 855PM chips, which did support external graphics, in Centrino laptops.

Despite criticisms, the Carmel platform won quick acceptance among OEMs and consumers. Carmel could attain or exceed the performance of older Pentium 4-M platforms, while allowing for laptops to operate for 4 to 5 hours on a 48 W-h battery. Carmel also allowed laptop manufacturers to create thinner and lighter laptops because its components did not dissipate much heat, and thus did not require large cooling systems.

[edit] Sonoma platform (2005)

Intel used Sonoma as the code-name for the second-generation Centrino platform, introduced in January 2005.

The Sonoma platform consists of:

  • an Intel Pentium M processor (code-named Dothan) with a 533 MT/s FSB, Socket 479 and
  • an Intel Mobile 915 Express series chipset (code-named Alviso with Intel's GMA 900), DDR2-533 and
  • the Intel PRO/Wireless 2200BG or 2915ABG mini-PCI Wi-Fi adapter (code-named Calexico2).

The Mobile 915 Express chipset, like its desktop version, supports many new features such as DDR2, PCI Express, Intel High Definition Audio, and SATA. Unfortunately, the introduction of PCI Express and faster Pentium M processors causes laptops built around the Sonoma platform to have a shorter battery-life than their Carmel counterparts; Sonoma laptops typically achieve between 3.5-4.6 hours of battery-life on a 53 W-h battery.

[edit] Napa platform (2006)

Napa Centrino Solo Yonah logo
Napa Centrino Duo Merom logo
-
Napa Centrino Solo Merom logo

The code-name Napa designates the third-generation Centrino platform, introduced in January 2006 at the Winter Consumer Electronics Show. The platform initially supported Intel Core Duo processors but the newer Core 2 Duo processors were launched and supported in this platform from July 27, 2006 onwards.

The Napa platform consists of:

  • Processors - Socket M / Micro-FCBGA
    • an Intel Core Solo, Core Duo (code-named Yonah) processor, or
    • an Intel Core 2 Duo (code-named Merom) processor with a 667 MT/s FSB for Napa Refresh platform, or
    • an Intel Core 2 Solo (code-named Merom) processor with 553 MT/s FSB for Napa Refresh platform (Sept 2007), and
  • an Intel Mobile 945 Express series chipset (code-named Calistoga with Intel's GMA 950), including ICH7M southbridge, and
  • the Intel PRO/Wireless 3945ABG mini-PCIe Wi-Fi adapter (code-named Golan), and
    • Some newer models (as of 1st quarter 2007) of the Napa Refresh platform contain the newer 4965AGN (a/b/g/draft-n) wireless cards.

Intel uses Centrino Duo branding for laptops with dual-core ("Core Duo") and ("Core 2 Duo") processors and retains the Centrino name for laptops with single core ("Core Solo") processors. Some of the initial Core Duo laptops, are still labeled as Intel Centrino rather than Centrino Duo.

[edit] Santa Rosa platform (2007)

The code-name Santa Rosa refers to the fourth-generation Centrino platform, which was released on Wednesday 9 May 2007.

Santa Rosa Centrino Duo Merom logo
-
Santa Rosa Centrino Pro Merom logo

The Santa Rosa platform consists of:

  • Processors - Socket P / Micro-FCBGA
    • an Intel Core 2 Duo (code-named Merom) second generation processor with 800 MT/s FSB, or
    • an Intel Core 2 Duo (code-named Penryn) 45nm processor with 800 MT/s FSB and SSE4.1, which will add 47 new instructions to SSSE3. It was scheduled for release in January 2008[2] for Santa Rosa Refresh platform
  • Intel Mobile 965 Express chipset (code-named Crestline): GM965 with Intel's GMA X3100 graphics technology or PM965 with discrete graphics, and ICH8M southbridge, 800 MT/s front side bus with Dynamic Front Side Bus Switching to save power during low utilization
  • Intel WiFi Link 4965AGN (a/b/g/draft-n) mini-PCIe Wi-Fi adapter (code-named Kedron).
    • Wireless-N technology boasts a 5X speed increase, along with a 2X greater coverage area, and supports 2.4 GHz and 5 GHz signal bands, with enough bandwidth for high definition audio and video streams.[4]

The Santa Rosa platform comes with dynamic acceleration technology. It allows single threaded applications to execute faster. When a single threaded application is running the CPU can turn off one of the CPU cores and overclock the active core. In this way the CPU maintains the same Thermal Profile as it would when both cores are active. Santa Rosa performs well as a mobile gaming platform due to its ability to switch between single threaded and multithreaded tasks.[2]. Other power savings come from an Enhanced Sleep state where both the CPU cores and the chipset will power down.

The wireless chipset update was originally intended to include WWAN Internet access via HSDPA (3.5G), (code-named Windigo) co-developed with Nokia [3][4]. After announcing a working partnership, both later retracted the deal citing the lack of a clear business case for the technology. [5]. Support for WiMAX (802.16) was originally scheduled for inclusion in Santa Rosa but appears to have been delayed until Montevina in 2008 [6].

The Santa Rosa platform is branded as "Centrino Pro" when combined with the enhanced security technologies Intel introduced with vPro and will be called "Centrino Duo" when they are not used.[7]

[edit] Montevina platform (2008)

The code-name Montevina refers to the fifth-generation Centrino platform, now formally named Centrino 2 to avoid confusion with previous Centrino platforms. It was scheduled for release at Computex Taipei 2008, which took place on June 3 - 7, 2008,[5] but has been delayed until July 14, due to problems with integrated graphics and wireless certification.[6] Montevina will support Penryn, Intel's 45nm die-shrink version of Core 2 processors.

Montevina Centrino 2 Penryn logo
-
Montevina Centrino 2 vPro Penryn logo

The Montevina platform consists of:

  • Processors - Socket P / Micro-FCBGA
    • a second-generation Intel Core 2 Duo (code-named Penryn) 45nm processor with 1066 MT/s FSB with clock speeds ranging from 2.26 GHz to 3.06 GHz, also featuring SSE4.1 support, which adds 47 new instructions to SSSE3. It is planned to consume no more than 29W, compared to Merom's and first-generation Penryn's 34W TDP.
  • a Mobile Intel 4 Series Express chipset (code-named Cantiga; GL40, GS45, GM45, GM47 or PM45) with Intel's GMA X4500 graphics technology and ICH9M southbridge, 1066 MT/s front side bus. The graphics core GM45/47 is expected to be clocked at 533/640MHz which will contain ten unified shaders, up from the eight provided by GMA X3100.
  • Wireless Modules
    • the Intel WiFi Link 5100/5300 mini-PCIe adapter (code-named Shiloh), and the add-on card WiMAX (802.16) (code-named Dana Point), or
    • the Intel combo WiFi/WiMAX Link 5150/5350 mini-PCIe adapter (code-named Echo Peak).

The Montevina platform is branded as "Centrino 2 vPro" when combined with security and manageability features built-in technologies.

[edit] Calpella platform (2009)

 This section contains information about scheduled or expected future computer chips.
It may contain preliminary or speculative information, and may not reflect the final specification of the product.

The code-name Calpella refers to the sixth-generation Centrino platform; it will be competing with AMD Fusion platform. It will premiere in Q2 2009 with the second iteration of Nehalem processors.[citation needed]

The Calpella platform consists of:

  • Processors - based on Intel Nehalem microarchitecture (code-named Gilo)
    • an Intel processor (code-named Auburndale) 45nm for Dual Core version, 35-45W TDP, or
    • an Intel processor (code-named Clarksfield) 45nm for Quad Core version, 45-55W TDP.

[edit] Mobile Internet Device

Main article: Intel Mobile Internet Device

[edit] Menlow platform (2008)

 This section contains information about scheduled or expected future computer chips.
It may contain preliminary or speculative information, and may not reflect the final specification of the product.
Centrino Atom logo

On the 2nd of March 2008, Intel introduced the Intel Atom processor[9], formerly code-named "Menlow", it is a new family of low-power processors designed specifically for Mobile Internet Devices (MIDs). The components are designed with thin, small designs and work together to enable the best mobile computing and Internet experience on mobile and low-power devices.

The Menlow platform consists of:

  • an Intel processor based on Intel Atom Architecture (code-named Silverthorne) 45nm version.
  • a low-power chip with PowerVR SGX integrated graphics
  • a wireless radio

[edit] See also

[edit] References

  1. ^ Intel Brand Names Updated
  2. ^ Intel Previews a New Family of Power-Saving Chips - New York Times
  3. ^ Intel dumbs down dual Santa Rosa cores with IDA - The INQUIRER
  4. ^ Rickwood, Lee. Intel Unveils Next Gen Processor. PCWorld.ca. Retrieved on 2007-05-09.
  5. ^ Kim, Arnold (2008-02-18). Next Mobile Intel Processors and Platform (Montevina) Due in June 2008. MacRumors.com.
  6. ^ Kircos, Bill (2008-05-28). Intel Delays Next-Generation Centrino Chipset. pcmag.com.
  7. ^ Marco Angione (2008-05-22). Notebook Centrino 2 con memorie DDR3-1333. Notebook Italia.
  8. ^ Tony Smith (2006-10-11). Intel to follow 'Santa Rosa' Centrino with 'Montevina'. The Register.
  9. ^ Intel Announces Intel® Atom™ Brand for New Family of Low-Power Processors

[edit] External links