Bahgat G. Sammakia
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Bahgat G. Sammakia is an Egyptian-American mechanical engineer. He is currently a professor of mechanical engineering and director of both the Integrated Electronics Engineering Center and the Small Scale Systems Packaging Center at Binghamton University a part of the State University of New York (SUNY) system. Dr. Sammakia has published over 80 technical papers in refereed journals and conference proceedings, holds 13 U.S. patents and 12 IBM technical disclosures. He has also contributed to three books[1].
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[edit] Education and career
Dr. Sammakia received his B.S. degree in 1977 from the University of Alexandria. He received his M.S. and Ph.D. degrees in 1980 and 1982, respectively from the State University of New York at Buffalo. All of his degrees are in mechanical engineering[2]. The title of his doctoral dissertation is "Transient natural and mixed convection flows and transport adjacent to an ice surface melting in saline water"[3].
After completing his Ph.D., Dr. Sammakia was a postdoctoral fellow at the University of Pennsylvania. He began working for IBM in 1984 as an engineer. He continued to work for IBM until 1998, holding various management positions during that time. Some of the groups that he managed at IBM include the thermal and mechanical analysis groups, the surface science group, the chemical lab, and the site technical assurance group[4].
He was honored by the Chancellor of the State University of New York in 2002 for research excellence[5].
Dr. Sammakia was the Interim Vice President for Research at Binghamton University from July of 2003 until July of 2004[6].
Dr. Sammakia is the editor of the Journal of Electronics Packaging, which is published by the American Society of Mechanical Engineers[7].
[edit] Patents
7,282,254 Surface coating for electronic systems
6,219,234 Method for using pulsating flow to improve thermal transport in systems
6,058,015 Electronic packages and a method to improve thermal performance of electronic packages
5,966,290 Electronic packages and a method to improve thermal performance of electronic packages
5,912,800 Electronic packages and method to enhance the passive thermal management of electronic packages
5,870,285 Assembly mounting techniques for heat sinks in electronic packaging
5,491,610 Electronic package having active means to maintain its operating temperature constant
5,420,520 Method and apparatus for testing of integrated circuit chips
5,109,318 Pluggable electronic circuit package assembly with snap together heat sink housing
5,028,984 Epoxy composition and use thereof
5,003,429 Electronic assembly with enhanced heat sinking
4,914,551 Electronic package with heat spreader member
4,849,856 Electronic package with improved heat sink
[edit] Book
- Benjamin Gebhart, Yogesh Jaluria, Roop L. Mahajan and Bahgat Sammakia (1988). Buoyancy Induced Flows and Transport. Hemisphere. ISBN 0-89116-402-2.
[edit] Selected Papers
- Arunasalam P, Ackler HD, Sammakia BG (Jul-Aug 2006). "Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks". Journal of Vacuum Science & Technology B 24 (4): 1780–1784. doi:.
- Desai A, Geer J, Sammakia B (Mar 2006). "Models of steady heat conduction in multiple cylindrical domains". Journal of Electronic Packaging 128 (1): 10–17. doi:.
- Desai A, Mahajan S, Subbarayan G, Jones W, Geer J, Sammakia B (Mar 2006). "A numerical study of transport in a thermal interface material enhanced with carbon nanotubes". Journal of Electronic Packaging 128 (1): 92–97. doi:.
- Watson SP, Murray BT, Sammakia BG (Jun 2001). "Computational parameter study of chip scale package array cooling". IEEE Transactions on Components and Packaging Technologies 24 (2): 184–190. IEEE. doi:.
- Sathe SB, Sammakia BG (Jun 2000). "A numerical study of the thermal performance of a tape ball grid array (TBGA) package". Journal of Electronic Packaging 122 (2): 107–114. ASME. doi:.
- Niu TM, Sammakia BG, Sathe S (Dec 1999). "Void-effect modeling of flip-chip encapsulation on ceramic substrate". IEEE Transactions on Components and Packaging Technologies 22 (4): 484–487. IEEE. doi:.
- Tran SK, Questad DL, Sammakia BG (Dec 1999). "Adhesion issues in flip-chip on organic modules". IEEE Transactions on Components and Packaging Technologies 22 (4): 519–524. IEEE. doi:.
- Sathe S, Sammakia B (November 1998). "A review of recent developments in some practical aspects of air-cooled electronic packages". Journal of Heat Transfer-Transactions of the ASME 120 (4): 830–839. ASME.
