130 nanometer

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CMOS manufacturing
processes

10 µm
3 µm
1.5 µm
1 µm
800 nm (0.80 µm)
600 nm (0.60 µm)
350 nm (0.35 µm)
250 nm (0.25 µm)
180 nm (0.18 µm)
130 nm (0.13 µm)
90 nm
65 nm
45 nm
32 nm (Double Patterning)
22 nm (End of Planar Bulk CMOS)
16 nm (Transition to Nanoelectronics)
11 nm (Nanoelectronics)

The 130 nanometer (130 nm or 0.13 µm) process refers to the level of semiconductor process technology that was reached in the 2000-2001 timeframe, by most leading semiconductor companies, like Intel, Texas Instruments, IBM, and TSMC.

The origin of the 130 nm value is historical, as it reflects a trend of 70% scaling every 2-3 years. The naming is formally determined by the International Technology Roadmap for Semiconductors (ITRS), hosted by Sematech.

Some of the first CPUs manufactured with this process include Intel Tualatin family of Pentium III processors.