Spansion

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Spansion Inc.

Type	Public (NASDAQ: SPSN)
Founded	2003
Headquarters	Sunnyvale, California, USA
Industry	Semiconductors
Products	Flash memory
Employees	8,800
Website	www.spansion.com

Spansion Inc. is a joint-venture between Fujitsu and AMD and that trades on NASDAQ under the symbol SPSN. Spansion has 8,400 employees and is headquartered in Sunnyvale, California.

[edit] History

In 1993, AMD and Fujitsu formed a 50-50 joint venture called FASL. In 2003, AMD increased its stake to 60%, and Fujitsu retained the remaining 40%. In December 2005, the joint venture went public, and AMD's stake decreased to 37%. The IPO raised $529 million, with Spansion selling 47,264,000 Class A shares at $12 per share, including 5,064,000 over-allotment shares.

[edit] Description

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Spansion Inc. provides Flash memory product lines to the markets. The Company's products enable enabling, storing and protecting digital content in the automotive, consumer electronics, networking and wireless markets. Its product offerings are designed for code execution and data storage. The Company's offering includes NOR architecture for code and ORNAND architecture for scalable data storage. Spansion has made an entry into the NAND portion of the cell phone market, through a family of wireless solutions integrating 90 nanometer MirrorBit ORNAND Flash memory with its NOR portfolio of products. With MirrorBit NOR for code execution and MirrorBit ORNAND for data storage, the solutions deliver a complete memory subsystem for a range of phones that enable digital versatile disc (DVD)-quality video, compact disc (CD)-quality audio and up to five-megapixel photos on wireless handsets.

Spansion offers system designers the broadest selection of NOR Flash memory, including five volts, three volts and 1.8 volts products from 1 megabit to 512 megabit. Packaging configurations include single-die packaged, Known Good Die (KGD), Pb-free compliant, and multi-chip product (MCP) configurations. Spansion has solutions based on MirrorBit Flash and Floating Gate Flash technology to meet customer needs. The product offered include conventional interface devices; Spansion Burst-Mode Interface Products and Spansion Page-Mode Interface Products; Serial Peripheral Interface (SPI) Products; MCP Solutions and Package-on-Package (PoP) Technology from Spansion.

MirrorBit is a price-performance Flash memory technology for wireless and embedded applications. The conventional interface devices interface with Joint Electron Device Engineering Council-standard pinouts and package is optimized for embedded applications, including consumer electronics, networking/telecom, automotive, industrial and personal computer (PC) peripherals. These devices are highly configurable, and MCP configurations are available for mobile phones and other wireless applications. Extended temperature and KGD options are offered for automotive systems. The linear burst-mode interface delivers very high-performance sequential read access. The linear page-mode interface delivers high-speed random or sequential access within an 8 or 16-byte page. After an initial data access of 50 nanoseconds, data can be read asynchronously from any other location within the page as fast as 20 nanoseconds. Page-mode devices also are available in MCP configurations for mobile phones and wireless applications.

The new Spansion S25FL Flash memory family enables to simplify system design of consumer electronics and personal computer peripherals, such as hard disk drives, optical drives, printers, cordless phones, digital subscriber line (DSL)/cable modems, and DVD players and recorders. SPI enables advanced packaging options. SPI packaging options available from Spansion include 8-pin SO, 8-contact WSON and Pb-free. Spansion Multi-Chip Product solutions enable feature-rich applications in space-constrained designs by combining high-performance Spansion Flash memory and other high-quality memory devices into a single, small, and consistent footprint. PoP is a packaging designed to vertically combine discrete logic and memory ball grid array (BGA) packages.