Shrink Small-Outline Package

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Shrink small-outline package (SSOP). A microchip package for surface-mount technology with "gull wing" leads protruding from the two long sides and a lead spacing of 0.025 inches.

[edit] See also

  • Plastic Small-Outline Package (PSOP)
  • Thin Small-Outline Package (TSOP)
  • Thin-Shrink Small Outline Package (TSSOP)


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