No clean processing

From Wikipedia, the free encyclopedia

No-clean processing refers to the printed circuit board assembly process that lets flux residues remain after reflow.

Reference: S. Zhan, M. H. Azarian and M. Pecht, “Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed with No-Clean Flux”, IEEE Transactions on Electronics Packaging Manufacturing, vol.29, no.3, p 217-223, July, 2006.

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