Integrated circuit packaging

From Wikipedia, the free encyclopedia

Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.

In the integrated circuit industry it is called simply packaging and sometimes semiconductor device assembly, or simply assembly. Also, sometimes it is called encapsulation or seal, by the name of its last step.

The following operations are performed at this stage.

• Die attaching
• IC Bonding
  • Wire bonding
    • Down bonding
  • Flip chip
  • Tab bonding
• IC encapsulation
  • Baking
  • Plating
  • Lasermarking
  • Trim and form

See also: B-staging

This electronics-related article is a stub. You can help Wikipedia by expanding it.