Fluoromethane
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| Fluoromethane | |
| Common name | methyl fluoride |
| Systematic name | fluoromethane |
| General | |
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| Chemical formula | CH3F |
| Molecular weight | 34.04 g/mol |
| Appearance | Colorless, odorless gas |
| CAS number | 593-53-3 |
| MSDS | Fluoromethane MSDS |
| Other names | |
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| Physical properties | |
| Density and phase at STP | ? g/cm3 (?) |
| Solubility | 166 cm3 per 0.1 kg water |
| Specific gravity | 0.5786 |
| Crystal structure | ? |
| pH (10% solution with water) (pKa) |
? |
| Acidity constant (pKa) |
? |
| Thermal decomposition | ? K (? °C) |
| Phase behavior | |
| Melting point | 131.4 K (−141.8 °C) |
| Boiling point | 195.0 K (−78.2°C) |
| Triple point | ? K (? °C) ? kPa |
| Critical point | 318.1 K (44.9 °C) 6280 kPa |
| Heat of fusion (ΔfusH) |
? kJ/mol |
| Entropy of fusion (ΔfusS) |
? J/mol·K |
| Heat of vaporization (ΔvapH) |
? kJ/mol |
| Safety | |
| Ingestion | ? |
| Inhalation | ? |
| Skin | ? |
| Eyes | ? |
| Flash point | ? °C |
| Autoignition temperature | ? °C |
| Explosive limits | ? - ?% |
| OSHA Permissible Exposure Limit (PEL) |
? ppm |
| NIOSH Immediate Danger to Life and Health (IDLH) |
? ppm |
| Precautions | |
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| Solid properties | |
| Standard enthalpy change of formation (ΔfH0solid) |
? kJ/mol |
| Standard molar entropy (S0solid) |
? J/(mol·K) |
| Heat capacity (Cp) |
? J/(mol·K) |
| Density | ? g/cm3 |
| Liquid properties | |
| ΔfH0liquid | ? kJ/mol |
| S0liquid | ? J/(mol·K) |
| Cp | ? J/(mol·K) |
| Density | 0.557 g/cm3 at saturation pressure at 25 °C |
| Gas properties | |
| ΔfH0gas | ? kJ/mol |
| S0gas | ? J/(mol·K) |
| Cp | 38.171 J/(mol·K) at 25 °C |
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Except where noted, all data was produced under conditions of standard temperature and pressure. |
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Fluoromethane, also known as methyl fluoride, Freon 41, Halocarbon-41 and HFC-41, is a non-toxic, liquefiable, and flammable gas at standard temperature and pressure. It is used in the manufacture of semiconductor and electronic products. In the presence of an RF field fluoromethane will dissociate into fluoride ions that selectively etch silicon compound films.
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