DIP-8

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NE555 from Signetics in dual-in-line package
NE555 from Signetics in dual-in-line package

DIP-8 is a commonly-used integral circuit package. The acronym DIP stands for "dual in-line package" while the number eight (8) denotes the number of connection pins protruding from the case.

Specifically, dual in-line packages have the same number of pins on both sides of the case. Thus each side has four pins.

Such a DIP package also employs a half-moon cutout to indicate the proper orientation of the component. The cutout may be matched with a drawing printed or silkscreened onto its position on a printed wiring board. Specifically, the cutout refers to the side that which is between pins one and eight of the DIP-8 package.

The surface-mount equivalent of the DIP-8 package is the SOIC-8 package.

[edit] Advantages

  • Easy to work with, making it popular for hobby work and prototyping.
  • Less susceptible to heat damage than SOIC counterparts.
  • Can be used with DIP-8-sized sockets for easy replacement.

[edit] Disadvantages

  • Relatively bulky for applications where board space is limited.
  • Generally more costly than SOIC counterparts.

[edit] Some common uses of the DIP-8 package

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