Die (integrated circuit)
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A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated. There are three commonly used plural forms: dice, dies, and die.
Typically, integrated circuits will be produced in large batches on a single wafer of electronic-grade silicon (EGS) through processes such as lithography. The resulting wafer is cut into many pieces, each containing one copy of the integrated ciruit that is being produced. Each one of these pieces is called a "die".
