Copper silicide
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Copper silicide (Cu5Si), also called pentacopper silicide, is an inorganic compound, a silicide of copper. Its CAS number is []. It is a solid crystalline material with the appearance of odorless silver powder or pieces. It is insoluble in water.
Copper silicide thin film is used for passivation of copper surfaces of copper-based chips, where it serves to suppress diffusion and electromigration and serves as a diffusion barrier. [1]
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