Bystronic

From Wikipedia, the free encyclopedia

Bystronic
Type Group
Founded 1986, since 1994 part of Conzzeta Holding, Zurich, Switzerland
Headquarters Niederönz, Switzerland
Key people Ferdi Töngi, CEO
Products Systems for processing sheet metal: Products in the segments laser cutting, waterjet cutting, bending, handling and automation, software and control, service and support
Revenue 403 Mio EURO (stand 2006)
Employees 1395
Parent Conzzeta Holding, Switzerland
Subsidiaries Worldwide
Website http://www.bystronic.com
Bystronic Headquarters in the Swiss village of Niederönz
Bystronic Headquarters in the Swiss village of Niederönz
The Bystronic experience at EuroBLECH 2006 in Hanover
The Bystronic experience at EuroBLECH 2006 in Hanover

Bystronic is a worldwide active supplier of high-quality solutions for the economical processing of sheet metal and other sheet materials. Customers profit from application-oriented systems and services for laser and waterjet cutting as well as bending.

Bystronic is represented worldwide by its own numerous sales and service subsidiaries and partner agencies. Hence consulting, sales and service are in the immediate proximity of the customer everywhere. In addition to the manufacturing facility in Niederönz (Switzerland), Bystronic has further manufacturing plants in Gotha (Germany) and Tianjin (China).


Contents

[edit] Business Units

Bystronic develops and manufactures systems for sheet metal processing. In addition to products from the three core activities laser cutting, waterjet cutting and bending, the company offers its customers high-performance handling and automation solutions and provides them with user-friendly programming and operation with requirement-oriented application programs. Furthermore, it guarantees rapidly available after-sales service worldwide.

Bystronic has a command of all key technologies and components. Every tenth employee is active in the design and development of products and services.

[edit] Laser Cutting

Within the laser cutting sector, Bystronic offers various product families each with its own individual profile and hence has the right solution for every problem.

Bystronic machines and systems guarantee maximum flexibility and the economic production of parts of any shape without the investment in high tool costs. The shortest of part cutting times are achieved thanks to the optimally matched cutting and processing technologies. Numerous proprietary developments such as the highly dynamic DHM drive motor, the Controlled Pulsed Piercing technique or the sheet positioning guarantee the customer high precision with all thicknesses of metal sheet without the need for reworking.

The latest generation of CO2 laser sources from Bystronic is characterized by wear-free and energy-saving semiconductor modulation, automatic beam optimization, constant high speed control of the laser, flying piercing and scanning.

Behind the latest innovation from Bystronic there lies not just a new machine, operating, assembly and logistics concept but also a unique new business model. ByVention: Everything included plus a two year warranty and preventive maintenance at a single price worldwide.

[edit] Waterjet Cutting

The abrasive waterjet cutting has a long tradition at Bystronic. The Bystronic Byjet is the first machine on the market that can be equipped as standard with a shuttle table which can be loaded and unloaded during the cutting process.

Laser and waterjet cutting complement one another. Using waterjet cutting a wide range of different materials can be processed. Since the materials are not subjected to thermal or mechanical stress, the cutting results are of a high quality. Expensive costs for reworking are minimized or are eliminated completely. In addition to the boundless diversity of materials that can be processed and the lack of any detrimental thermal effects during the cutting process, the cost-effectiveness of this process is an additional important benefit. The high level of the utilization of the material, the multilayer cutting as well as the simultaneous use of several cutting heads permit efficient and cost-saving cutting.

As with the laser cutting segment, all the process-related components such as the high-pressure pump, the precision cutting head and the cutting basin are all proprietary developments.

[edit] Bending

With its machines in the bending segment Bystronic covers the full spectrum from basic to high-end solutions. Depending on the demands placed by the individual customer on their bending processes and results, the user can select from a broad range of pressbrakes.

Thanks to the three-point bending technology a unique precision is achieved. Perfect bending angles are achieved thanks to the Integrated Process Control (IPC) and automatic Pressure Reference (PR) bending technology. Additionally, the use of robot cells can lead to marked increases in productivity and to a constantly high bending precision. With bending pressures from 60 tons upwards and variable bending lengths to well in excess of ten meters (synchronous tandem operation of two machines), also here Bystronic offers the correct solution for every requirement.

[edit] Milestones of the Bystronic Group

  • 1964: Foundation. Development, production and sales of system solutions for glass processing (today Bystronic Maschinen AG, Bützberg, Switzerland).
  • The early 80's: Start of the development of the laser cutting machines.
  • 1986: Start of the production and sales of laser cutting machines (today Bystronic Laser AG, Niederönz, Switzerland).
  • 1994: Bystronic becomes a part of Conzzeta Holding, Zurich, Switzerland. Subsequently separation of the two Business Units. Systems for sheet metal processing (Bystronic) and systems for glass processing (Bystronic glass).
  • 1997: With the acquisition of the Swiss Hämmerle AG, Bystronic becomes for the first time a supplier of bending machines (pressbrakes).
  • 2002: Expansion of the product range in the bending segment through the takeover of the Beyeler Group with its production facility in Gotha, Germany, and AFM Fabtech (production facility in Tianjin, China).
  • 2006: 20-year anniversary of Bystronic Laser AG.

[edit] Bystronic Key Figures

Revenue according to Market Regions (status 2006)
Europe North/East 46 %
Europe South/West including CIS and South America 24 %
Asia/Pacific 14 %
NAFTA 14 %
status 2006
Revenues CHF 632 million / EURO 403 million
Employees 1395, of which 540 in Switzerland
status 2005
Revenues CHF 490 millions / EURO 330 millions
Employees 1309, of which 510 in Switzerland
status 2004
Revenues CHF 440 millions / EURO 286 millions
Employees 1155, of which 510 in Switzerland
status 2003
Revenues CHF 369 millions / EURO 240 millions
Employees 1110, of which 510 in Switzerland

[edit] Web links

[edit] Source

  • Bystronic Company Presentation
  • Bystronic Virtual Plant 0611
  • Wasserstrahlschneiden, Materialbearbeitung mit einem Hochdruckwasserstrahl, Marcel Kolb, 2006, 72 pages, ISBN 978-3-937889-47-4
In other languages