Talk:Semiconductor-die cutting
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Die Cutting sounds COOL.
[edit] Plural of Die
_ _ I relied on a quarter-century-old AmHerDict which is clear that the plural of "die", in the sense of small blocks of material, is "dice", which is logical since the resemblance to gambling dice indicates the origin there rather than industrial "taps and dies". (And "die" was well established in semiconductor tech terminology well before the '80s, even tho not specifically acknowledged by AmHer.)
_ _ That being said, usage is not always logical, and contrary evidence would be welcome to me.
_ _ That being said, the use of the word "dicing" in the article means that simply replaing "dice" by "dies" violates the principle of minimum astonishment: some kind of acknowledgement of the disconnect between "dicing" and "dies" would be needed.
--Jerzy·t 19:56, 2005 August 2 (UTC)
[edit] Saw Geometry
I'm not clear that this is a toothed saw, despite that being implicit in the language i corrected, "circular saw with diamond tipped blades". ("Circular saw" is a lousy term for "machine making multiple simultaneous cuts with its multiple circular blades", so i infer a saw with one blade having multiple teeth in my edited version. However, the "saw" in question might be called that by those using it, but still be more accurately described as a grinder i.e., a disc with a circumferential surface that does not feature notches between teeth but instead is rough bcz the industrial diamonds to its uniform surface have projecting corners; in that case we need to document both the name "saw" for it and its sharing the function rather than the structure of saws: the structure of a circular saw is a disc having quite regularly spaced projections, while that of a grinder is a disc whose circumference has randomly located "grit" that satisfies only statistical specifications for its roughness.
--Jerzy·t 19:56, 2005 August 2 (UTC)
