Semiconductor-die cutting

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In the manufacturing of micro-electronic devices, die cutting or dicing is a process of reducing a wafer containing multiple identical integrated circuits to dice each containing one of those circuits.

During this process, a wafer with up to thousands of circuits is cut into individual pieces, each called a die. In between the functional parts of the circuits, a thin non-functional spacing is foreseen where a saw can safely cut the wafer without damaging the circuit. This spacing is called the scribe. The width of the scribe is very small, typically around 100 μm. A very thin and accurate saw is therefore needed to cut the wafer into pieces. Usually the dicing is performed with a water-cooled circular saw with diamond-tipped teeth.

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