Power electronic substrate

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The role of the substrate in power electronics is twofold: to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool the components. Compared to the techniques used in microelectronics, these substrates must carry higher currents, and provide a higher isolation voltage (up to several thousand volts). They also must operate over a wide temperature range (up to 150 or 200°C).

[edit] Direct bond copper substrate

Structure of a direct bonded copper substrate (top) and an insulated metal substrate (bottom).

Direct bond copper substrates are commonly used in power modules, because of their very good thermal performance. They are composed of a ceramic tile (commonly alumina) with a sheet of copper bonded to both sides by a high-temperature oxidation process. The top copper layer is chemically etched using printed circuit board technology to form an electrical circuit, while the bottom copper layer is usually kept plain. The substrate is attached to a heat spreader by soldering the bottom copper layer to it.

Ceramic material used in DBC include:

• alumina (Al₂O₃), which is widely used because of its low cost. It is however not a really good thermal conductor and is relatively brittle.
• aluminium nitride (AlN), which is more expensive, but has far better thermal performance.
• beryllium oxide (BeO), which has good thermal performance, but is often avoided because of its toxicity when the powder is ingested or inhaled.

One of the main advantages of the DBC substrates is their low coefficient of thermal expansion, which is relatively close to that of silicon (compared to pure copper). This ensures relatively good thermal cycling performances. ^[1]

[edit] Insulated metal substrate

Insulated metal substrate (IMS) consists of a metal baseplate (aluminium is commonly used because of its low cost and density) covered by a thin layer of dielectric (usually an epoxy-based layer) and a layer of copper (35 µm to more than 200 µm thick). The FR-4-based dielectric is usually thin (about 100 μm) because it has poor thermal conductivity compared to the ceramics used in DBC substrates.

Due to its structure, the IMS is a single-sided substrate, i.e it can only accommodate components on the copper side. In most applications, the baseplate is attached to a heatsink to provide cooling, usually using thermal grease and screws. Some IMS substrates are available with a copper baseplate for better thermal performances.

Compared to a classical printed circuit board, the IMS provides a better heat dissipation. It is one of the simplest way to provide efficient cooling to surface mount components. ^[2]

[edit] Other substrates

• When the power devices are attached to a proper heatsink, there is no need for a thermally efficient substrate. Classical printed circuit board (PCB) material can be used (this method is typically used with through-hole technology components). This is also true for low-power applications (from some milliwatts to some watts), as the PCB can be thermally enhanced by using thermal vias or wide tracks to improve convection. An advantage of this method is that multilayer PCB allows design of complex circuits, whereas DBC and IMS are mostly single-sided technologies. ^[3]

• Flexible substrates can be used for relatively low-power applications. As they are built using Kapton as a dielectric, they can withstand high temperatures and high voltages. Their intrinsic flexibility makes them resistant to thermal cycling damage.

• Ceramic substrates (thick film technology) can also be used in some applications (such as automotive) where reliability is more important than good power dissipation. ^[4]

[edit] References

1. ^ Source: Curamik, manufacturer of DBC [1]
2. ^ Source: The Bergquist company [2]
3. ^ Thermal Management in High-Density Power Converters , Martin März, International Conference on Industrial Technology ICIT'03 Maribor, Slovenia, December 10 - 12, 2003 [3] (pdf document, last accessed 6/5/06)
4. ^ Quick presentation of several applications and features of the thick film substrates [4]

• The thermal performances of IMS, DBC and thick film substrate are evaluated in Thermal analysis of high-power modules Van Godbold, C., Sankaran, V.A. and Hudgins, J.L., IEEE Transactions on Power Electronics, Vol. 12, N° 1, Jan 1997, pages 3-11, ISSN 0885-8993 [5] (restricted access)