MicroLeadFrame

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A MicroLeadFrame (MLF) is a type of chip scale microchip package. Amkor Technology introduced the MicroLeadFrame package in late 1999. The leads are flush with the package body, and the leadframe's metal die-attach paddle is exposed on the bottom of the package, enabling the use of down-bonds or conductive die-attach material, which in turn allows for a stable, low-impedance ground.