Talk:Land grid array

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"The new socket has had numerous problems with heat dissipation, and bent pins in motherboards." I'm not sure if this is fully true, I have never experienced or read anything about heat dissipation issues, of what i've read the problems are with the Prescott core and not with the interface... this should be looked into. The heat dissipation issue on the Prescott core is not related to the new LGA 775 Socket but rather it is a deficiency of the Netburst architecture on which the Prescott core was based. The heat and perfomance issues of the Netburst architecture, which was supposed to scale all the way up to 10 GHZ, caused Intel much grief and competition problems to such a degree that it forced Intel to introduce a brand new architectute, dubed Core. —The preceding unsigned comment was added by Berat556 (talk • contribs).

[edit] bga

"LGA is less expensive to produce than both PGA and the similar ball grid array (BGA) interfaces."

i can imagine that this may be true for the chip alone but i can't imagine its true if you include the cost of the socket (which bga avoids) can anyone clarify? Plugwash 00:01, 22 March 2006 (UTC)

Someone forgot to include the Socket 771, used on Xeon servers, even though it is widely used. —The preceding unsigned comment was added by Berat556 (talk • contribs).