Integrated circuit encapsulation

From Wikipedia, the free encyclopedia

You have new messages (last change).

Integrated circuit encapsulation (IC encapsulation, encapsulation) refers to the design and manufacturing of protective packages for integrated circuits.

It is the last stage of IC packaging (semiconductor package assembly) in semiconductor device fabrication. The integrated circuit die is being encapsulated with ceramic, plastic, or epoxy to prevent physical damage or corrosion.

Sometimes the term "encapsulation" is used synonymously to "packaging".

This electronics-related article is a stub. You can help Wikipedia by expanding it.
Retrieved from "http://en.wikipedia.org../../../i/n/t/Integrated_circuit_encapsulation.html"
In other languages