Flip-chip pin grid array
From Wikipedia, the free encyclopedia
Flip-Chip Pin Grid Array (FC-PGA or FCPGA) is the package of certain Intel Celeron, Pentium III, and Pentium 4 family microprocessors. FC-PGA processors fit into Zero Insertion Force (ZIF) Socket 370 and Socket 478 motherboard sockets, similar packages have also been used by AMD.
FC-PGA packages have the die facing downwards on the top of the package with the back of the die exposed, This allows the die to have a more direct contact with the heatsink than is possible with conventional packages.
FC-PGA packaging is used by Pentium III processors, and Celeron 533, unofficially called 533A, processors onward. Earlier Celeron processors used PPGA packaging, the fastest was at 533 MHz.
FC-PGA2, adds a heat spreader over the silicon core and is used on late Pentium III processors and most Pentium 4 and Celeron processors using Socket 478 (1.8 micron Willamette and 1.3 micron Northwood). FC-PGA4 is used by Intel Pentium 4 and Celeron D processors using 90 nm process (Prescott based) also with integrated heat spreader. Intel Mobile Pentium 4-M processors did not have the integrated heat spreader and so use FC-PGA packaging.
Intel replaced FC-PGA style packaging with the land grid array (LGA775) or FC-LGA4 packaging on Prescott-based Pentium 4 and Celeron D processors which no longer have pins.
Celeron processors are also available in Slot 1 SEPP. Pentium III processors are also available in Slot 1 Single Edge Contact Cartridge 2 packaging. Pentium 4 processors are also available in Socket 423 Organic Land Grid Array (OLGA) on Interposer (OOI) (INT2 and INT3) and Socket T LGA775 packaging.
Adapters are available to allow a PPGA Celeron or FC-PGA Celeron's and Pentium III's to plug into a Slot 1 connector.
