Failure analysis

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Failure analysis is the process of collecting and analyzing data to determine the cause of a failure and how to prevent it from recurring. It is an important discipline in many branches of manufacturing industry, such as the electronics industry, where it is a vital tool used in the development of new products and for the improvement of existing products. However, it also applies to other fields such as business management and military strategy.

Contents

[edit] Electronics

[edit] Semiconductor Failure Analysis

The failure analysis of semiconductor devices involves the use of the following tools and techniques:

[edit] Microscopes

[edit] Sample Preparation Equipment

  • Jet-etcher
  • Plasma etcher
  • Back Side Thinning Tools
    • Mechanical Back Side Thinning
    • Laser Chemical Back Side Etching

[edit] Spectroscopic Analysis

[edit] Device Modification

[edit] Electrical Analysis

[edit] Surface Analysis

[edit] Optical Beam Techniques

  • Optical Beam Induced Current (OBIC)
  • Thermal Laser Stimulation (TLS)
    • Optical Beam Induced Resistance Change (OBIRCH)
    • Thermally Induced Voltage Alteration (TIVA)
  • Optical Beam Heat Induced Current (OBHIC)
  • Light Induced Voltage Alteration (LIVA)
  • Dynamic Laser Stimulation

[edit] Semiconductor Probers

This list is incomplete; you can help by expanding it.

[edit] See also

[edit] Bibliography

  • Martin, Perry L., Electronic Failure Analysis Handbook, McGraw-Hill Professional; 1st edition (February 28, 1999) ISBN 0-07-041044-5.
  • Microelectronics Failure Analysis, ASM International; Fifth Edition (2004) ISBN 0-87170-804-3
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