Talk:Die preparation

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he two and using a redirect and such. -- Rickz0rz USA 07:22, 12 January 2006 (UTC)

I suggest merging Wafer mounting and Semiconductor-die cutting. They're two steps of one process, die preparation. Is there a reason to have three articles instead of one? -- Perfecto Canada 23:25, 5 November 2005 (UTC)

I agree - merge. I my mind, Wafer mounting and Semiconductor-die cutting do not contain enough information to be seperated, and since they are all part of Die preparation, they should be merged. --mabahj 10:23, 16 February 2006 (UTC)

I disagree. Semiconductor-die cutting is by itself a very complicated and involved technology. Besides, the contents seem rather outdated. Will it be acceptable to have a separate entry if there were more updated information on this?

More (updated) information is in general always good. The only reason I voted merge, was that boths articles were stubs. I'll change my vote if the articles increase in size. Go for it! mabahj 07:50, 14 June 2006 (UTC)
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