Die (integrated circuit)

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A die in the context of integrated circuits is a small piece of semiconducting material on which a given circuit is fabricated. Typically Integrated Circuits will be produced in large batches on a single wafer of Electronic-grade silicon (EGS) through processes such as lithography. The resulting wafer is cut into many pieces, each containing one copy of the integrated ciruit that is being produced. Each one of these pieces is called a "die".